MediaTek has launched the MediaTek Dimensity 7100, a new 5G system-on-chip for smartphones. With the Dimensity 7100, MediaTek is targeting mid-range smartphones globally, with a focus on providing power savings and advanced features to compete in the mobile Processor market.
MediaTek Dimensity 7100: Specifications
According to MediaTek, the Dimensity 7100 aims to provide better efficiency and performance for everyday users. It is built on TSMC’s 6nm node, and the company states that it delivers 5 per cent more power efficient, 23 per cent better modem efficiency, and 16 per cent improved multimedia playback compared to the Dimensity 7050. It also supports up to 45W Fast charging and support for universal fast charging standard adapters, with an extra-low voltage feature aimed at increasing battery life.
The MediaTek Dimensity 7100 features an octa-core CPU with four Arm Cortex-A78 cores up to 2.4 GHz for performance and four Arm Cortex-A55 cores up to 2.0 GHz for efficiency in a 64-bit configuration. It also features the Arm Mali-G610 MC2 GPU, which MediaTek states increases gaming performance by 8 per cent over the Dimensity 7050. The chipset’s memory support includes LPDDR5 at 5500 Mbps or LPDDR4x at 4266 Mbps, along with UFS 3.1 storage.
Also Read: MediaTek Dimensity 9500 3nm SoC Launched with 4-lane UFS 4.1 Support and More
The Chipset supports up to 200MP camera sensors with advanced HDR video using DCG and DAG technology. Additional features include multi-frame noise reduction and face detection with fast autofocus, with 6x faster face detection and 10x larger Autofocus detection area compared to competitors, according to MediaTek. The company states that these features will provide better selfies, portraits, and detailed photos in various conditions.
The MediaTek Dimensity 7100 supports displays up to 1200 x 2600 Resolution at 120 Hz refresh rates, with 10-bit colour depth and HDR compatibility including HDR10, HLG, HDR10+, and HDR Vivid. The chipset’s connectivity includes a 3GPP Release-16 5G modem offering up to 3.3 Gbps link speeds, supports carrier aggregation across FDD and TDD bands, and works in global standalone and non-standalone modes.
The MediaTek 5G UltraSave 3.0+ feature is aimed at improving power efficiency by 30 per cent using Release-16 upgrades. The chipset supports Wi-Fi 6 with a 1T1R antenna, Bluetooth 5.4 for long-range connections over kilometres without cellular service, and Bluetooth/Wi-Fi operation in the 2.4 GHz band. It also offers GNSS support, including GPS, BeiDou, Glonass, Galileo, QZSS, and NavIC. The chipset supports 2G, 3G, 4G, and 5G networks with EDGE, GSM, TD-SCDMA, and WCDMA, along with dual 5G SIMs and voice over radio.
MediaTek Dimensity 7100: Availability
Phones using the MediaTek Dimensity 7100 are expected to launch soon. Infinix Note EDGE is expected to be the first device to use this processor with launch expected in January 2026.
Author: The Mobile Indian Network
Source: The Mobile Indian
Reviewed By: Editorial Team
